Automatic Wafer Stress Gauge ( MX2012-69-RA-1L )
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300mm wafer Thickness, TTV, Warp, FPD, Stress Measurement |
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Application for CVD and PVD Stress analysis |
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Full-automated system: Robot, Loadport, Pre-aligner, Mini-environment |
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High throughput: 50 wph |
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Thickness Accuracy: ±0.5 µm, Repeatability: ±0.15 µm (2σ) |
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