Automatic Wafer Geometry Gauge ( MX2013-R-1C )
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Total measurement solution for 300 mm and 200 mm THIN and HIGH WARP Wafers |
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300 mm and 200 mm wafer Thickness, TTV, Warp, FPD Measurement |
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High throughput：78 wph |
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Thickness Accuracy: ±1.0 µm, Repeatability: ±0.3 µm (1σ) |
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MS Windows environment for easy operation |
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