JC's Chunson - Semiconductor-- G&N ( MPS NO-940 )

Automatic Wafer Grinder ( MPS NO-940 )

	Polymer concrete machine base for better vibration absorption and thermal stability
	TTV within 1µm
	Capable to grind wafer up to 300 mm dia
	Special version for double side grinding of sawn 200 and 300 mm wafers
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