Wafer Grinder ( MPS 2 R400DS )
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For grinding polishing of Silicon and GaAs in the 50 mm up to 150 mm wafer diameters |
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Ceramic vacuum chucks clamping |
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Diamond grinding wheel #400 ~ #2000 |
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Twin-spindle : two grinding wheels in one spindle |
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Consistent, predictable grinding results, Minimal TTV |
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