JC's Chunson - Semiconductor -- G&N ( Multi-Nano/3-300 )

Fully Automatic Surface Grinder ( Multi-Nano/3-300 )

	High throughput 35 wph
	Parallelism TTV ≤ 2 µm, Thickness Variation ± 2 µm
	Wafer Diameter up to 300 mm
	Friendly software interface for operation
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