Contactless Layer Thickness Measurement ( SemDex 101 )
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Manual loading, automated measurement |
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Up to two sensors configuration |
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Compact table-top instrument with optimised footprint |
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Accepts wafers measuring up to 150mm (6") and polymer objects measurable |
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Framed and unframed wafers |
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Optional vacuum chucks |
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Integrated vacuum generation for fixing wafers |
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Optionally available with high-resolution HD CMOS camera |
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Air-suspended measuring table for vibration-free measurement |
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Calibration body integrated into chuck |
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Available in coated steel housing |
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User-friendly WaferSpect software |
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