Wafer Grinder
MPS 2 R400DS
♦ For grinding polishing of Silicon and GaAs in the 50 mm up to 150 mm wafer diameters
♦ Ceramic vacuum chucks clamping
♦ Diamond grinding wheel #400 ~ #2000
♦ Twin-spindle : two grinding wheels in one spindle
♦ Consistent, predictable grinding results, Minimal TTV
冲成股份有限公司 / JC's Chunson Limited
Tel:+886-2-3234-1279 Fax:+886-3234-7056
Add.:17F., No. 216, Jian 8th Rd., Zhonghe Dist., New Taipei City 235042 , Taiwan