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Wafer Grinder

MPS 2 R400DS


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♦ For grinding polishing of Silicon and GaAs in the 50 mm up to 150 mm wafer diameters

♦ Ceramic vacuum chucks clamping

♦ Diamond grinding wheel #400 ~ #2000

♦ Twin-spindle : two grinding wheels in one spindle

♦ Consistent, predictable grinding results, Minimal TTV

 冲成股份有限公司 / JC's Chunson Limited         

Tel:+886-2-3234-1279 Fax:+886-3234-7056

Add.:17F., No. 216, Jian 8th Rd., Zhonghe Dist., New Taipei City 235042 , Taiwan