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Fully Automatic Surface Grinder

Multi-Nano/3-300

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♦ High throughput 35 wph

♦ Parallelism TTV ≤ 2 µm, Thickness Variation ± 2 µm

♦ Wafer Diameter up to 300 mm♦ Friendly software interface for operation

 冲成股份有限公司 / JC's Chunson Limited         

Tel:+886-2-3234-1279 Fax:+886-3234-7056

Add.:17F., No. 216, Jian 8th Rd., Zhonghe Dist., New Taipei City 235042 , Taiwan