Fully Automatic Surface Grinder
Multi-Nano/3-300
♦ High throughput 35 wph
♦ Parallelism TTV ≤ 2 µm, Thickness Variation ± 2 µm
♦ Wafer Diameter up to 300 mm♦ Friendly software interface for operation
冲成股份有限公司 / JC's Chunson Limited
Tel:+886-2-3234-1279 Fax:+886-3234-7056
Add.:17F., No. 216, Jian 8th Rd., Zhonghe Dist., New Taipei City 235042 , Taiwan