Automatic Wafer Grinder
MPS NO-940
♦ Polymer concrete machine base for better vibration absorption and thermal stability
♦ TTV within 1µm
♦ Capable to grind wafer up to 300 mm dia
♦ Special version for double side grinding of sawn 200 and 300 mm wafers
冲成股份有限公司 / JC's Chunson Limited
Tel:+886-2-3234-1279 Fax:+886-3234-7056
Add.:17F., No. 216, Jian 8th Rd., Zhonghe Dist., New Taipei City 235042 , Taiwan