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Automatic Wafer Grinder

MPS NO-940


        

♦  Polymer concrete machine base for better vibration absorption and thermal stability

♦ TTV within 1µm

♦ Capable to grind wafer up to 300 mm dia

♦ Special version for double side grinding of sawn 200 and 300 mm wafers

 冲成股份有限公司 / JC's Chunson Limited         

Tel:+886-2-3234-1279 Fax:+886-3234-7056

Add.:17F., No. 216, Jian 8th Rd., Zhonghe Dist., New Taipei City 235042 , Taiwan