MX 203-58-37-B
E+H
Fast contactless geometry gauge for thin 125– 200mm silicon wafers.
Measurement type
。Thickness
。Flatness (TTV)
。Bow
。Warp
| Wafer Diameter | 125mm, 150mm, 200mm |
| Thickness Accuracy | ±2.0 µm |
| Resolution | 75nm |
| Thickness range | 200 - 800 µm |
| Automatic wafer | no |
| Bow & Warp include gravity connection | no |
| Software | MXNT |