MX 203-6-33-B
E+H
Fast contactless geometry gauge for thin 100–150mm silicon wafers.
Measurement type
。Thickness
。Flatness (TTV)
。Bow
。Warp
| Wafer Diameter | 100mm, 125mm, 150mm |
| Thickness Accuracy | ±0.6 µm |
| Resolution | 50nm |
| Thickness range | 300 - 900 µm |
| Automatic wafer | no |
| Software | MXNT |