E+H
Fast contactless geometry gauge for 75–200mm non-conductive and semi-insulating wafers.
Measurement type
。Thickness
。Flatness (TTV)
。Bow
。Warp
| Wafer Diameter | 75mm - 150mm |
| Accuracy | ±1 µm |
| Resolution | 0.1µm |
| Thickness range | 300 - 800 µm |
| Non-conductive substrates | yes |
| Semi-insluation materials | above 107 Ohm*cm |
| Software | MXNT |