MX 203-8-37-B
E+H
Fast contactless geometry gauge for thin 150mm and 200mm silicon wafers.
Measurement type
。Thickness
。Flatness (TTV)
。Bow
。Warp
| Wafer Diameter | 150mm, 200mm |
| Thickness Accuracy | ±0.5 µm |
| Resolution | 50nm |
| Thickness range | 200 - 700 µm |
| Automatic wafer | no |
| Bow & Warp include gravity connection | no |
| Software | MXNT |