E+H
Fast contactless geometry gauge for 100–156mm solar wafers.
Measurement type
。Thickness
。Flatness (TTV)
。Bow
。Warp
。Sori
| Wafer Diameter | 100mm, 125mm, 156mm |
| Thickness Accuracy | ±0.5 µm |
| Resolution | 50nm |
| Thickness range | 160 - 700 µm |
| Automatic wafer | no |
| Software | MXNT |