Vision solutions are intended to provide wafer manufacturers with advanced solutions to measure SEMI-compliant geometry parameters and critical surface Nano-topography with non-contact technology. The equipment is designed for manual loading metrology and inspection. It measures bow, warp, TTV, LTV, and qualifies surface roughness, nano-topography down to nm level in one single shot measurement. Its full field of view, leading edge throughput and small footprint bring the best TCO adapted to volume wafer fabs.