冲成股份有限公司
我要諮詢

PRODUCTS

  1. 首頁
  2. 經營品牌
  3. Advanced Spectral Technology（AST）
  4. 光學缺陷檢測系統
  5. AST-MEMS Workstation
AST-MEMS Workstation

AST-MEMS Workstation

MEMS Inspection Workstation

The MEMS Inspection Workstation provides advanced imaging capabilities for microelectromechanical systems, delivering exceptional inspection capabilities including subsurface visualization and high-precision metrology performance within an integrated ergonomic workstation platform. Visible, Near-Infrared (NIR), and Short-Wave Infrared (SWIR) imaging technologies provide the capability to image through silicon and other wafer materials to inspect hidden structures, measure critical dimensions, and verify alignment in complex MEMS devices.
我要諮詢

。Inspection of Sub Surface Structures on Si and other wafer materials

。Optical Contrast Enhancement: Recipe Selectable Band-Pass, Long-Pass Filters provide a tunable solution for optimized imaging performance

。Digital Contrast Enhancement: Recipe Control of Contrast w/ Histogram

。Advanced Infrared Imaging Technology:

     ．Standard: Visible Though NIR (400-1050nm)

     ．Optional: SWIR (900nm-1700nm)

     ．Optional: High-Resolution Options

。Automated & Programmable Illumination, Wavelength Selection, Aperture Diaphragm, and Camera Exposure / Gain ensures best Image Contrast

。Advanced Vision Tool Library for Executing Optimized OA Focus, Pattern Find, and Geometric Measurements

 

The MEMS workstation integrates specialized infrared imaging technology with high-precision motion control to examine subsurface features that are invisible to conventional optical inspection methods. This integrated workstation captures detailed images for executing critical dimensional measurements and confirming overlay alignment patterns between wafer layers making it ideal for inspecting bonded structures and analyzing complex MEMS configurations.

 

。200mm x 200mm X-Y travel and 200mm Z travel

。Imaging capabilities from visible spectrum through NIR (400-1050nm) with optional SWIR (900-1700nm)

。Recipe-selectable band-pass and long-pass filters for optical contrast enhancement

。Digital contrast enhancement with histogram-based recipe control

。High-resolution optical system with 5X, 10X, 20X, 50X, and 100X BF IR objectives

。Vibration isolation options are available including static, passive, and active vibration control

 

。Die-to-die layer alignment inspection

。Pre and post bonded wafer analysis

。Failure analysis on devices and substructures

。Inspection of low doped material using NIR (up to 1100nm)

。Inspection of highly doped wafers using SWIR (900-1650nm)

。Through-wafer inspection and metrology

。Geometric measurement of subsurface features

Platform

‧200MM X 200MM X-Y Travel ( 300mm x 300mm optional), 200mm Z Travel

Optics

‧Automated, High-Resolution Optical System

‧5X, 10X, 20X, 50X, & 100X BF IR Objectives

‧Optional BF/DF Objectives for NIR

‧Can mix NIR & BF/DF Obj. on Turret

‧Broadband or LED Light Source

‧Standard Video Auto-Focus

‧Optional Tracking Laser Auto-Focus

‧See Through Full Thickness Wafers

‧Telecentric, Low Mag Versions available

Software

‧ScopeViewer3 Software Application Suite

‧Flexible Part-Programming

‧Advanced Vision Tools & Metrology Features 

‧SECS-GEM factory Interface 

‧Full Recipe Control of all Imaging Functions

‧Recipe Generation in Python Layer

‧Flexible Configuration for Long Term Support of Hardware and Software Components