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AST-MEMS Automated

AST-MEMS Automated

Automated MEMS Inspection System

The Automated MEMS Inspection System provides advanced imaging capabilities for microelectromechanical systems, delivering exceptional subsurface visualization and precise metrology. With both Near-Infrared (NIR) and Short-Wave Infrared (SWIR) imaging technologies, this system penetrates silicon and other wafer materials to inspect hidden structures, measure critical dimensions, and verify alignment in complex multi-layer MEMS devices.
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。Inspection of Sub Surface Structures on Si and other wafer materials

。Optical Contrast Enhancement: Recipe Selectable Band-Pass, Long-Pass Filters provide a tunable solution for optimized imaging performance

。Digital Contrast Enhancement: Recipe Control of Contrast w/ Histogram

。Advanced Infrared Imaging Technology:

     ．Standard: Visible Though NIR (400-1050nm)

     ．Optional: SWIR (900nm-1700nm)

     ．Optional: High-Resolution Options

。Automated & Programmable Illumination, Wavelength Selection, Aperture Diaphragm, and Camera Exposure / Gain ensures best Image Contrast

。Advanced Vision Tool Library for Executing Optimized OA Focus, Pattern Find, and Geometric Measurements

 

The automated MEMS Inspection system integrates specialized infrared imaging technology with high-precision motion control to examine subsurface features that are invisible to conventional optical inspection methods. The system captures detailed images through full-thickness wafers, making it ideal for inspecting bonded wafers, 3D stacked structures, and other complex MEMS configurations.

 

。Imaging from visible spectrum through NIR with optional SWIR

。Digital contrast enhancement with histogram-based recipe control

。Resolution better than 1 micron at 100X magnification

。Multiple objective options (5X, 10X, 20X, 50X, and 100X)

。Automated illumination, wavelength selection, aperture diaphragm, and camera settings

。Platform options with travel ranges up to 300mm x 300mm with 100-200mm Z-travel

 

。Wafer-to-wafer layer alignment inspection for 3D stacking

。Die-to-die alignment verification in bonded structures

。Failure analysis on devices and substructures

。Inspection of low and highly doped wafer materials

。Through-wafer inspection and metrology

。Multi-layer wafer via inspection

。Geometric measurement of subsurface features

。Pattern recognition and alignment verification

。MEMS device quality control

Platform

‧300+mm x 300+mm w/ 100mm Z-axis Travel

‧ISO 5 (Class 100) Cleanroom Compatible

‧ISO 4 (Class 10) Cleanroom Option

‧Semi S2 / S8 Protocol Compliant

Light Tower for System Status

Optics

‧Automated, High-Resolution Optical System

‧5X, 10X, 20X, 50X, & 100X BF IR Objectives

‧Optional BF/DF Objectives for NIR

‧Can mix NIR & BF/DF Obj. on Turret

‧Broadband or LED Light Source

‧Standard Video Auto-Focus

‧Optional Tracking Laser Auto-Focus

‧See Through Full Thickness Wafers

‧Resolution better than 1 Micron at 100X Mag

‧Telecentric, Low Mag Versions available

Software

‧ScopeViewer3 Software Application Suite

‧Flexible Part-Programming

‧Advanced Vision Tools & Metrology Features 

‧SECS-GEM factory Interface 

‧Full Recipe Control of all Imaging Functions

‧Recipe Generation in Python Layer

‧Flexible Configuration for Long Term Support of Hardware and Software Components