冲成股份有限公司
AST-MWIR Workstation

AST-MWIR Workstation

Mid-Wave Infrared Inspection & Analysis System

The AST-MWIR provides the ability to detect defects in power semiconductors, including packaged-level dies that are well matched in the 3-5µm temperature range, where these power devices typically operate, providing good thermal contrast for inspection and detecting surface & sub-surface defects.

Thermographic Microscope for detection of defects using MWIR band (3-5 microns)

Thermal detection to 20 mK

Fully integrated & self-contained workstation with dual probe platforms

Supports “Black Body” option for enhanced sub-surface defect detection

Advanced system & image analysis software

InSb FPA on a closed cycle dewar (no LN2 required)

Magnifications from macro to 1x, 2.5x, 4x, 5x, and 8x

Spatial resolution below 10 microns

(Optional) Cooled MWIR camera (InSb/MCT) option for high frame rate & detection sensitivity

(Optional) “Lock-In Thermography” option available to detect weak thermal signals for capturing subtle subsurface defects

 

The Mid-Wave Infrared Inspection & Analysis System (MWIR) is highly effective as a non-contact diagnostic tool for quickly identifying where thermal problems are occurring.  Our MWIR thermography provides a good solution for performing package-level reliability testing & hot-spot location on a macro-scale detecting defective cells, damaged bond wires, voids in die attach, or localized shorts that produce visible hot regions (hot spot detection). 

 

In-line inspection of power modules, busbars, or assemblies under load, where IR thermography provides a solution for rapid fault localization and analysis using our ScopeViewer™ software to flag abnormal heating & defect detection.

 

Detection of Thermally Identifiable Defects within the Mid-Wave 3-5µm IR Band

Thermal Detection to 20 mK

Thermal Imaging Hot Spot Detection in Power Semiconductors, Modules, & Devices

MWIR Thermography Solutions for Package-level Reliability Testing & Rapid Fault Localization

Process & System Monitoring: Inline Inspection of Power Modules, Busbars, or packaged power chips & assemblies under load to flag abnormal heating

Thermo Graphic Applications in Semiconductor, Medical Devices, Aerospace, & Material Sciences

Platform

‧200mm x 200mm Travel Precision X-Y Stage, Motorized

‧150mm Travel Z-axis, Motorized

‧Workstation Rack-Mount Computer with ScopeViewer™ Software

‧Integrated Probe Platforms on each side of X-Y Stage

‧Magnification from Macro to 1x, 2.5x, 4x, 5x, and 8x

‧InSb FPA on a closed cycle dewar (no LN2 required)

‧Cooled InSb/MCT MWIR camera is optional

SoftWare

‧ScopeViewer3 Software Application Suite

‧Flexible Part-Programming

‧Advanced Vision Tools & Metrology Features

‧Full Recipe Control of all Imaging Functions

‧Recipe Generation in Python Layer