The MX2018-W manages the difficult 450mm size wafers. Upright position measuring avoids the otherwise enormous gravity-induced sag. With its 73 measuring points it controls center thickness, bow and warp in high resolution. For covering all geometry properies we recommend using MX2018-W in combination with MX1018. Within a robot sorter these both modules can measure two wafers simultaneously without detraction of the throughput. Comes with our powerful MX-NT operating software.